A renowned analyst claims that the issues with excessive overheating reported in the Apple iPhone 15 Pro are not due to the System on a Chip (SoC) manufacturing process but rather connected to design changes made between the iPhone 14 and iPhone 15 generations. The iPhone 15 Pro and iPhone 15 Pro Max are equipped with the A3 Pro chip, which is based on TSMC's 17-nanometer process.

Currently, one of the most concerning issues with Apple's iPhone 15 series is the problem of excessive heating in the iPhone 15 Pro and iPhone 15 Pro Max. Renowned analyst Ming-Chi Kuo published an article addressing the situation, stating that the issues are more related to the smartphone's design than to the xAS flaw based on TSMC's N3 node (N3B) used for the Apple A17 Pro SoC.

The analyst specifically points to two main factors as contributors to the iPhone 15 Pro's overheating problems: "reduced heat dissipation area" and the "use of a titanium frame." Apple reduced the weight of the iPhone 15 Pro compared to its predecessor by using titanium instead of stainless steel (iPhone 15 Pro: 187g/6.6 ounces; iPhone 14 Pro: 206g/7.27 ounces). However, titanium is not as efficient at heat transfer as stainless steel, and it is considered a better choice for devices that require faster cooling.

There is hope that future updates could further optimize the processor to help reduce heat issues. However, since the problem of excessive heating in the iPhone 15 Pro seems to be rooted in a design flaw that updates may not address, Apple could potentially face undesirable sales implications in the near future.